添加 Ni/Cu 复合中间层的 Al/Mg 双金属界面微观组织和力学性能

Interfacial microstructure and mechanical properties of Al/Mg bimetals with Ni/Cu composite interlayers

摘要

Al/Mg 双金属材料兼具铝合金与镁合金的优异性能，在航空航天等领域具有重要的应用前景。扩散连接是制备双金属材料最有效的手段之一，但连接过程中界面易形成脆性 Al–Mg 金属间化合物，显著降低界面性能。通过在 Al/Mg 双金属界面处添加 Ni 箔/Cu 箔复合中间层，实现界面处的固/液扩散连接，探究保温时间对界面微观组织演变和结合强度的影响。结果表明，当连接温度为 500 ℃时，Mg 合金基体与 Cu 箔发生共晶反应，使界面发生液相扩散，Ni 箔与 Al 合金基体界面为固相扩散。保温时间从 15 min 延长至 30 min，Cu 箔逐渐被消耗至完全消失。保温 45 min 时，界面开始呈现波纹状形貌。保温 60 min 时，界面最大剪切强度达到 53.78 MPa，此时 Al/Mg 双金属界面结构为 Al/Al₃Ni₂+Al₃Ni/Ni/Mg₂Ni/Mg₃AlNi₂/Mg，断裂发生在 Mg₂Ni 和 Mg₃AlNi₂ 相层界面附近。

Abstract

Al/Mg bimetallic materials combine the excellent properties of aluminum and magnesium alloys, offering the promising application prospects in aerospace and other fields. Diffusion bonding is one of the most effective methods for fabricating the bimetallic materials. However, the tendency for brittle Al–Mg intermetallic compounds to form at the interface significantly reduces the bonding strength. To address this issue, the Ni/Cu composite interlayers were introduced at the Al/Mg bimetallic interface to achieve the solid/liquid diffusion bonding. The effects of holding time on the interfacial microstructural evolution and bonding strength were systematically investigated. The results show that at the bonding temperature of 500 ℃, the eutectic reaction occurs between the Mg matrix and the Cu foils, promoting the liquid-phase diffusion at the interface, while the solid-state diffusion takes place between the Ni foils and the Al matrix. As the holding time increases from 15 min to 30 min, the Cu foils are gradually consumed and eventually disappear. When the holding time reaches 45 min, the wavy interface morphology begins to form. The maximum shear strength of 53.78 MPa is achieved after holding for 60 min, the interfacial structure is composed of Al/Al ₃Ni ₂+Al ₃Ni/Ni/Mg ₂Ni/Mg ₃AlNi ₂/Mg, and the fracture occurs near the interface between Mg ₂Ni and Mg ₃AlNi ₂.

关键词

Al/Mg 双金属 / Ni/Cu 中间层 / 固/液扩散连接 / 界面组织 / 剪切强度

Key words

Al/Mg bimetals / Ni/Cu interlayers / solid/liquid diffusion bonding / interfacial microstructure / shear strength

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