To improve the surface morphology of copper substrates, a design method was proposed for composite structure polishing tools. Based on the principle of linear hydrodynamic pressure and material removal model, numerical simulation analyses of hydrodynamic pressure flow field characteristics were carried out to verify the accuracy of simulation data and clarify the influences of processing parameters of copper substrate linear hydrodynamic pressure polishing on surface morphology. Results show that composite structures have a higher mean hydraulic pressure and smaller standard deviation than that of single spiral structures, non-uniform groove width structures, and variable thickness structures. Composite structures combine the advantages of high material removal rate of spiral structures, good surface morphology uniformity of non-uniform groove width structures, and variable thickness structures during polishing. The surface roughness parameters Sa, Sq, and PV are optimized to 4.778 nm, 6.086 nm, and 9.900 nm, respectively, when the processing parameters are set as follows: polishing time of 45 min, polishing speed of 24 000 r/min, and polishing gap of 20 μm.
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