多物理场仿真在电子电镀中的应用与智能化发展

Multiphysics simulation for electronic electroplating: applications and intelligent development

摘要

[目的] 综述多物理场仿真技术在电子电镀工艺开发与优化中的应用现状，并探讨其与人工智能融合的智能化发展趋势。[方法] 结合填孔电镀与图形电镀两类典型场景，分析在 COMSOL 平台中对电场、传质场及流场等关键物理场的耦合建模方法，探讨该技术在预测镀层生长、评估添加剂作用、优化槽体结构与流动状态等方面的具体应用路径。[结果] 大量仿真案例的模拟结果与实际电镀数据吻合良好。通过对电流密度、流场状态等关键参数的仿真优化，能够显著改善镀层均匀性与填孔效果，可为实际工艺调试提供有效指导。[结论] 基于有限元方法的仿真技术可作为电子电镀工艺优化的高效工具，显著降低试错成本与研发周期。未来仿真技术与人工智能的深度融合将进一步推动电镀工艺的智能化发展，助力电子制造向数字化、精准化方向演进。

Abstract

[Objective] The current application status of multiphysics simulation technology in the development and optimization of electronic electroplating processes was reviewed, and its intelligent development trend through integration with artificial intelligence was discussed. [Method] Focusing on two typical scenarios, via-filling electroplating and pattern electroplating, the coupled modeling methods for key physical fields, including the electric field, mass transfer field, and flow field, on the COMSOL platform were analyzed. The specific application paths of this technology were explored in aspects such as predicting deposit growth, evaluating the effects of additives, and optimizing bath structure and flow conditions. [Result] Simulation results from a large number of case studies are in good agreement with actual electroplating data. Through the simulation-based optimization of key parameters such as current density and flow field states, significant improvements in coating uniformity and via-filling performance can be achieved, providing effective guidance for practical process debugging. [Conclusion] Finite element-based simulation technology can serve as an efficient tool for electronic electroplating process optimization, significantly reducing trial-and-error costs and development cycles. In the future, the deep integration of simulation technology and artificial intelligence will further promote the intelligent development of electroplating processes, driving electronic manufacturing towards digitalization and precision.

关键词

电子电镀 / 多物理场仿真 / 有限元分析 / 镀层均匀性 / 人工智能

Key words

electronic electroplating / multiphysics simulation / finite element analysis / coating uniformity / artificial intelligence

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基金资助

广东省重点领域研发计划项目(2023B0101010002)