明胶对氯化物体系电镀镉及镀层性能的影响

李兰晨 ,  王琼 ,  王胜永 ,  成书宇 ,  邹宇洁 ,  李亚强 ,  李若鹏 ,  刘吉飞

电镀与涂饰 ›› 2026, Vol. 45 ›› Issue (6) : 34 -43.

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电镀与涂饰 ›› 2026, Vol. 45 ›› Issue (6) : 34 -43. DOI: 10.19289/j.1004-227x.2026.06.005
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明胶对氯化物体系电镀镉及镀层性能的影响

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Effect of gelatin on cadmium electroplating in chloride-based bath and coating properties

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[目的]针对氯化物镀镉体系镀液稳定性差、镀层易粗糙等问题,研究明胶作为添加剂对该体系镀液性能及镉镀层综合性能的影响,为高耐蚀 Cd 镀层制备提供理论依据。[方法]在由 45 g/L CdCl 2·2.5H 2O、240 g/L NH 4Cl 和 35 g/L NaCl 组成的镀镉基础液中添加不同质量浓度明胶,在 1.0 A/dm 2 下电镀 20 min 制备 Cd 镀层。通过线性扫描伏安法(LSV)研究明胶对 Cd 电沉积阴极极化的影响;通过霍尔槽试验测定镀液分散能力;利用扫描电镜(SEM)、激光共聚焦显微镜(CLSM)及接触角测试仪表征 Cd 镀层的微观形貌、表面粗糙度和润湿性;通过动电位极化曲线测试和电化学阻抗谱(EIS)检测 Cd 镀层在 3.5% NaCl 溶液中的耐蚀性;并借助 COMSOL Multiphysics 仿真模拟亲水/疏水镀层的点腐蚀过程。[结果]明胶能显著抑制 Cd 电沉积,进而改善镀层微观形貌、降低表面粗糙度,并提高镀层疏水性与耐蚀性。明胶质量浓度为 1.0 ~ 2.0 g/L 时,镀液分散能力较好,Cd 镀层综合性能更佳,尤其是质量浓度为 1.0 g/L 时具有最佳耐蚀性。仿真模拟显示,疏水镀层腐蚀电流密度显著低于亲水镀层,且其分布更均匀,腐蚀坑深度更浅。[结论]在氯化物镀镉体系中添加适量明胶可有效改善镀液分散能力,显著提升 Cd 镀层疏水性与耐蚀性。本研究为氯化物镀镉添加剂的筛选及高性能镀层制备提供了实验与理论支持。

Abstract

[Objective] To address the poor bath stability and rough coating surface commonly encountered in chloride cadmium plating, the effect of gelatin as an additive on the bath performance and the overall properties of cadmium coatings were studied, aiming to provide a theoretical basis for preparing highly corrosion resistant Cd coatings. [Method] Cd coatings were obtained by electroplating at 1.0 A/dm 2 for 20 min from a basic plating bath composed of 45 g/L CdCl 2·2.5H 2O, 240 g/L NH 4Cl, 35 g/L NaCl, and various mass concentrations of gelatin. The effect of gelatin on the cathodic polarization of Cd coating was studied by linear sweep voltammetry (LSV). The throwing power of the bath was studied by Hull cell electroplating test. The microstructure, surface roughness, and wettability of Cd coating were characterized by scanning electron microscopy (SEM), laser confocal microscopy (CLSM), and contact angle measurements. The corrosion resistance of Cd coating in 3.5% NaCl solution was examined by potentiodynamic polarization curves and electrochemical impedance spectroscopy (EIS). In addition, the pitting corrosion process of hydrophilic and hydrophobic coatings was simulated using COMSOL Multiphysics. [Result] Gelatin significantly inhibited cadmium electrodeposition, thereby improving the coating microstructure, reducing surface roughness, and enhancing both hydrophobicity and corrosion resistance. When the gelatin concentration was in the range of 1.0-2.0 g/L, the bath showed good throwing power and the Cd coating achieved superior overall performance; in particular, the best corrosion resistance was obtained at 1.0 g/L. Simulation results revealed that the corrosion current density of hydrophobic coating was significantly lower and more uniformly distributed than that of hydrophilic coatings, resulting in shallower corrosion pits. [Conclusion] The addition of an appropriate amount of gelatin to the chloride cadmium plating bath effectively improves the throwing power and significantly enhances the hydrophobicity and corrosion resistance of Cd coatings. This study provides experimental and theoretical support for the selection of additives and the preparation of high-performance coatings in chloride cadmium plating bath.

关键词

氯化物 / 电镀镉 / 明胶 / 表面形貌 / 疏水性 / 耐蚀性 / 仿真模拟

Key words

chloride / cadmium electroplating / gelatin / surface morphology / hydrophobicity / corrosion resistance / simulation

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李兰晨,王琼,王胜永,成书宇,邹宇洁,李亚强,李若鹏,刘吉飞. 明胶对氯化物体系电镀镉及镀层性能的影响[J]. 电镀与涂饰, 2026, 45(6): 34-43 DOI:10.19289/j.1004-227x.2026.06.005

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基金资助

国家自然科学基金(22402041)

国家自然科学基金(22502032)

国家自然科学基金(22541202)

福州大学贵重仪器设备开放测试基金(2025T017)

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