低温环氧固化胶的制备与性能研究

Preparation and Properties of Low-temperature Epoxy Curing Adhesive

摘要

论文旨在探索低温环氧固化胶的制备工艺及其性能优化。通过引入特殊结构的硫醇固化剂和有机硅橡胶增韧剂，低温环氧固化胶的稳定性、耐湿热性和韧性得到了显著提升。论文详细讨论了不同结构的硫醇固化剂对低温环氧固化胶的性能影响，而有机硅橡胶增韧剂的加入则显著提高了低温环氧固化胶的剥离强度、韧性和耐冲击性能。论文通过制备工艺优化、性能测试和微观结构分析等实验方法，对低温环氧固化胶的性能进行了全面评估。结果显示，通过合理控制硫醇固化剂和有机硅橡胶增韧剂的添加量，可以制备出性能优异的低温环氧固化胶。

Abstract

This paper aims to explore the preparation process and performance optimization of low-temperature epoxy curing adhesive. By introducing the special structure of thiol curing agent and silicone rubber hardening agent, the stability, damp-heat resistance and toughness of the low-temperature epoxy curing adhesive have been significantly improved. This paper discusses the influence of thiol curing agent of different structures on the performance of low temperature epoxy curing adhesive, while the addition of silicone rubber toughening agent significantly improves the stripping strength, toughness and impact resistance of low temperature epoxy curing adhesive. This paper comprehensively evaluates the performance of low-temperature epoxy curing adhesive through experimental methods of preparation process optimization, performance testing and microstructure analysis. The results showed that the low-temperature epoxy curing adhesive with excellent performance can be prepared by reasonably controlling the addition amount of thiol curing agent and silicone rubber toughening agent.

关键词

低温固化 / 硫醇固化剂 / 剥离强度

Key words

low temperature curing / thiol curing agent / stripping strength

参考文献

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[3] 胡玉明. 环氧固化剂及添加剂[M]. 北京: 化学工业出版社, 2011.