硅片加工中激光微纳加工技术的应用与发展

Application and development of laser micro-nano processing technology in silicon wafer processing

摘要

激光微纳加工技术以其高精度、高效率及非接触式的独特优势，成为硅片精密加工领域的重要手段。该技术利用超短脉冲激光的特性，实现硅片表面微结构制备、微孔钻削、精密切割以及微纳器件制造，突破了传统加工方式在精度和功能集成上的瓶颈。然而，激光微纳加工过程中，仍存在热影响区域难以控制、加工精度难以稳定以及设备功能单一等关键问题，严重制约了该技术在工业生产中的推广应用。因此，深入研究激光微纳加工机理、工艺参数优化以及与自动化技术融合已成为硅片加工领域的重要发展方向。

Abstract

Laser micro-nano processing technology, with its unique advantages of high precision, high efficiency and non-contact type, has become an important means in the field of silicon wafer precision processing. The technology makes use of the characteristics of ultra-short pulse laser to realize the preparation of surface microstructure of silicon wafer, microhole drilling, precision cutting and the manufacturing of micro-nano devices, breaking through the bottleneck of precision and function integration of traditional processing methods. However, in the process of laser micro-nano processing, there are still some key problems, such as the difficult control of the thermal influence area, the difficult stable processing accuracy and the single equipment function, which seriously restrict the popularization and application of this technology in industrial production. Therefore, the in-depth study of laser micro-nano processing mechanism, process parameter optimization and integration with automation technology has become an important development direction in the field of silicon wafer processing.

关键词

激光微纳加工 / 硅片加工 / 微纳结构 / 超短脉冲激光 / 工艺优化

Key words

laser micro-nano processing / silicon wafer processing / micro-nano structure / ultra-short pulse laser / process optimization

参考文献

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