低温烧结铜浆在功率模块封装中的可靠性研究

Reliability Study of Low-Temperature Sintered Copper Paste in Power Module Packaging

摘要

随着功率模块向高功率密度与高可靠性方向发展，传统银浆材料因成本高昂及电迁移风险难以满足需求，低温烧结铜浆凭借低成本、高导电性及环保优势成为关键替代方案。本研究针对大面积烧结均匀性差、热-机械耦合失效显著等问题，系统优化铜浆配方与烧结工艺（温度、压力、气氛），通过微观结构表征与加速寿命测试揭示其可靠性机制。结果表明，纳米铜粉改性及梯度功能设计可显著提升界面结合强度，热循环寿命较传统工艺提高，为功率模块封装提供理论支撑与技术参考。

Abstract

With the development of power modules toward high power density and high reliability, traditional silver pastes can no longer meet application requirements due to their high cost and susceptibility to electromigration. Low-temperature sintered copper pastes, featuring low cost, high conductivity, and environmental friendliness, have emerged as a key alternative. This study addresses issues such as poor uniformity in large-area sintering and significant thermo-mechanical coupling failures. By systematically optimizing the copper paste formulation and sintering process parameters (temperature, pressure, and atmosphere), and by employing microstructural characterization and accelerated lifetime testing, the reliability mechanisms are revealed. The results show that nano-copper powder modification and gradient functional design can significantly enhance interfacial bonding strength, improving thermal cycling lifetime compared with conventional processes. This work provides theoretical support and technical guidance for power module packaging.

关键词

烧结铜浆 / 大功率封装 / 半导体封装 / 大面积烧结 / 可靠性

Key words

sintered copper paste / high-power packaging / semiconductor packaging / large-area sintering / reliability

参考文献

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