“巯基配位-晶种诱导”碳银组装复合型吸波材料

王旭

材料科学与应用技术 ›› 2026, Vol. 5 ›› Issue (2) : 10 -13.

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材料科学与应用技术 ›› 2026, Vol. 5 ›› Issue (2) : 10 -13. DOI: 10.12349/msat.v5i2.11151

“巯基配位-晶种诱导”碳银组装复合型吸波材料

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Thiol Coordination-Crystal Seed Induced Carbon Silver-Assembled Composite Absorbent Material

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摘要

针对传统碳/金属复合吸波材料界面电阻大、阻抗匹配差的问题,本文提出一种分子级界面桥接策略。通过巯基乙酸分子在碳纳米管表面引入活性硫醇基团(-SH),利用硫-铂(S-Pt)配位化学锚定铂纳米晶种,进而诱导银纳米线的定向原位生长,构筑碳纳米管/银纳米线(CNT/AgNWs)化学键合异质结构。系统研究了Pt晶种密度对AgNWs形貌的影响规律,揭示了S-Pt配位对界面电子传输的调控机制。所制备的复合材料在2–18 GHz频段内表现出优异的吸波性能,最小反射损耗达-43.5 dB(11.2 GHz),有效吸收带宽(RL<-10 dB)为5.8 GHz。该材料通过协同界面极化损耗、导电网络损耗及等离子体共振损耗,实现了阻抗匹配与电磁损耗的平衡。本研究为高性能碳/金属复合吸波材料的界面设计提供了新思路。

Abstract

To address the issues of high interfacial resistance and poor impedance matching in traditional carbon/metal composite absorbing materials, this study proposes a molecular-level interface bridging strategy. Sulfhydryl groups (-SH) are introduced onto carbon nanotube (CNT) surfaces via mercaptan acetic acid molecules, followed by platinum nanocrystal seeding through sulfur-platinum (S-Pt) coordination chemistry. This induces directional in-situ growth of silver nanowires, forming a chemically bonded heterostructure of carbon nanotubes/silver nanowires (CNT/AgNWs). The systematic investigation of Pt seed density effects on AgNW morphology reveals the regulatory mechanism of S-Pt coordination on interfacial electron transport. The fabricated composite exhibits excellent microwave absorption performance across the 2–18 GHz frequency range, with a minimum reflection loss of -43.5 dB (at 11.2 GHz) and effective absorption bandwidth (RL < -10 dB) of 5.8 GHz. By synergistically utilizing interfacial polarization loss, conductive network loss, and plasma resonance loss, the material achieves optimal balance between impedance matching and electromagnetic loss. This study provides novel insights for interface design of high-performance carbon/metal composite absorbing materials.

关键词

吸波材料 / 碳纳米管 / 银纳米线 / 界面桥接 / 阻抗匹配

Key words

absorbent materials / carbon nanotubes / silver nanowires / interface bridging / impedance matching

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王旭. “巯基配位-晶种诱导”碳银组装复合型吸波材料[J]. 材料科学与应用技术, 2026, 5(2): 10-13 DOI:10.12349/msat.v5i2.11151

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参考文献

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