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摘要
电子元器件失效风险识别乃是保障电子系统可靠性的关键所在。本文依据物质特性与能量交互原理,构建起多维度检测技术体系,涉及外观检查、电性能测试、无损检测、环境应力筛选以及材料分析这五大技术方向。借助跨学科理论的融合,解析检测技术在显性缺陷与隐性风险识别中的运作机制,揭示微观结构变化向宏观性能异常的传导路径。所获研究成果为电子元器件全生命周期管理赋予了理论支持,促使检测技术从被动诊断朝主动预防转变,对提高产业质量控制水准有重大参考意义。
Abstract
Risk identification of electronic component failure is the key to ensuring the reliability of electronic systems. This article constructs a multidimensional detection technology system based on the principles of material properties and energy interaction, involving five major technical directions: appearance inspection, electrical performance testing, non-destructive testing, environmental stress screening, and material analysis. By integrating interdisciplinary theories, analyze the operational mechanism of detection technology in identifying explicit defects and implicit risks, and reveal the transmission path from microstructural changes to macroscopic performance anomalies. The research results obtained provide theoretical support for the full life cycle management of electronic components, promoting the transformation of detection technology from passive diagnosis to active prevention, and have significant reference significance for improving the quality control level of the industry.
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李星儒,郭可欣.
电子元器件失效风险识别中的检测技术研究[J].
科技创新与工程, 2026, 3(1): 38-40 DOI:10.12349/tie.v3i1.9001
| [1] |
赵福阳. 基于自动化技术的新型电子元器件检修方法研究[J]. 家电维修, 2025, (12): 183-189
|
| [2] |
刘江, 王宇峰. 机载电子元器件国产化替代应用验证技术研究[J]. 计算机测量与控制, 2025, (12): 107-113
|
| [3] |
陶园华, 程立江, 袁明涛, 廖民书豪. 电子元器件中零件毛刺控制技术研究及发展[J]. 机电元件, 2025, (04): 26-28
|
| [4] |
张小刚. 数据分析在电子元器件表面组装工艺质量改进中的应用[J]. 电子技术, 2025, (08): 134-142
|
| [5] |
窦超, 蔡亚辉, 杨忠良. 基于质量管控电子元器件优选管理系统建设研究[J]. 航空标准化与质量, 2025, (04): 56-65
|