基于伯努利吸附的超薄硅片转运机械手结构研究

Structure of a manipulator for ultra-thin silicon wafer transfer based on Bernoulli adsorption

摘要

随着集成电路制造向高集成度与高良率方向发展，超薄硅片在生产过程中的转运安全性与稳定性问题日益凸显。传统接触式或真空吸附式转运方式在应用中易引发硅片翘曲、微裂纹及污染等风险，难以满足超薄化工艺需求。基于伯努利吸附原理的非接触式转运方式，通过高速气流在硅片表面形成稳定负压区，可在降低机械接触应力的同时实现可靠吸附。本文围绕超薄硅片转运需求，系统分析伯努利吸附作用机理与硅片力学特性的匹配关系，重点探讨转运机械手在吸附结构、整体布局及关键部件设计方面的结构特征与设计要点，为相关装备结构优化提供技术参考。

Abstract

With the development of integrated circuit manufacturing toward higher integration density and higher yield, the safety and stability of ultra-thin silicon wafer handling during production have become increasingly critical. Conventional contact-based or vacuum suction handling methods are prone to inducing wafer warpage, micro-cracks, and surface contamination, making them difficult to meet the requirements of ultra-thin wafer processing. A non-contact handling approach based on the Bernoulli adsorption principle forms a stable negative pressure region on the wafer surface through high-speed airflow, enabling reliable adsorption while reducing mechanical contact stress. Focusing on the handling requirements of ultra-thin silicon wafers, this paper systematically analyzes the compatibility between the Bernoulli adsorption mechanism and the mechanical characteristics of wafers, and emphasizes the structural features and design considerations of the handling manipulator in terms of adsorption structure, overall layout, and key component design, providing technical references for the structural optimization of related equipment.

关键词

伯努利吸附 / 超薄硅片 / 转运机械手 / 结构设计 / 非接触转运

Key words

Bernoulli adsorption / ultra-thin silicon wafer / handling manipulator / structural design / non-contact handling

参考文献

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