超薄硅片加工中的应力分析与断裂控制

Stress analysis and fracture control in ultrathin silicon wafer processing

摘要

超薄硅片作为半导体和微电子领域的关键材料，其在加工过程中由于机械、热和化学作用导致的应力问题直接影响产品的质量和可靠性。本文围绕超薄硅片加工中的应力分析与断裂控制展开研究，首先分析了不同加工工艺和环境条件下硅片内部应力的来源、分布及演变规律，探讨了机械应力、热应力及化学应力对硅片性能的综合影响。在应力分析方法方面，本文建立了基于有限元分析的应力模型，并结合应力测试技术对加工过程中应力场进行模拟和预测。在断裂控制方面，本文深入研究了硅片断裂的机理，通过断裂力学理论对断裂形式和特征进行分析，提出了应力释放和缓解的有效方法，并优化了加工工艺以提高硅片的断裂强度。研究结果为提升超薄硅片加工的稳定性和安全性提供了理论依据和技术支持。

Abstract

As a key material in the field of semiconductor and microelectronics, ultra-thin silicon wafer due to mechanical, thermal and chemical stress problems in the processing process directly affects the quality and reliability of products. This paper focuses on stress analysis and fracture control in ultra-thin silicon wafer processing. Firstly, it analyzes the source, distribution and evolution law of internal stress of silicon wafer under different processing processes and environmental conditions, and discusses the comprehensive influence of mechanical stress, thermal stress and chemical stress on the performance of silicon wafer. In terms of stress analysis methods, this paper establishes a stress model based on finite element analysis, and combines stress testing technology to simulate and predict the stress field during processing. In terms of fracture control, this paper deeply studies the mechanism of silicon wafer fracture, analyzes the fracture form and characteristics through the fracture mechanical theory, puts forward the effective method of stress release and relief, and optimizes the processing process to improve the fracture strength of silicon wafer. The results provide theoretical basis and technical support for improving the stability and safety of ultra-thin silicon wafer processing.

关键词

超薄硅片 / 应力分析 / 断裂控制 / 有限元分析 / 加工工艺

Key words

ultra-thin silicon wafer / stress analysis / fracture control / finite element analysis / processing technology

参考文献

[1] 张立安. 超薄单晶硅片加工检测技术的研究进展[J]. 现代工业经济和信息化, 2022, 12(09): 27-29.

[2] 汲国鑫, 宋德, 陈卫军. 超薄硅片制备工艺的优化[J]. 长春理工大学学报(自然科学版), 2022, 45(02): 1-5.

[3] 汲国鑫. 超薄硅片的制备工艺及其光电性质的研究[D].导师：宋德. 长春理工大学, 2021.

[4] 孙洁. 超薄硅片倒角工艺研究[J]. 电子工业专用设备, 2016, 45(04): 17-19.

[5] 邱维. 超薄单晶硅伸缩性折叠性研究及应用[D].导师：吴星涛. 四川师范大学, 2014.