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摘要
以实际工程需求为导向,对现有电子元件测试流程的关键步骤与运行机制进行系统梳理,发现当前流程在需求预测、分级标准、执行效率以及可追溯性等方面存在明显不足。这些问题不仅影响检测结果的准确性,也制约了整体生产组织的协同效率。为此,本文以问题为中心,构建覆盖全流程的优化架构,从采购前的风险评估与需求预判、检测分级策略的精细化制定、检测执行环节的标准化与自动化提升、数据管理体系的完善以及全过程可追溯机制的建立等四个关键维度提出改进方案。通过将组织管理、技术手段与制度规范深度融合,实现检验流程的提质增效与闭环管理,为工程应用提供更加可靠、高效的电子元件质量保障体系。
Abstract
Based on actual engineering requirements, this paper systematically reviews the key steps and operating mechanisms of the existing electronic component testing process, and finds that there are significant deficiencies in demand forecasting, grading standards, execution efficiency, and traceability in the current process. These issues not only affect the accuracy of the detection results, but also constrain the collaborative efficiency of the overall production organization. To this end, this article focuses on the problem and constructs an optimized architecture that covers the entire process. Improvement plans are proposed from four key dimensions: risk assessment and demand prediction before procurement, refinement of detection and grading strategies, standardization and automation of detection execution, improvement of data management system, and establishment of a traceability mechanism throughout the entire process. By deeply integrating organizational management, technical means, and institutional norms, the quality and efficiency of inspection processes can be improved and closed-loop management can be achieved, providing a more reliable and efficient electronic component quality assurance system for engineering applications.
关键词
Key words
[Author(id=1278417561579230145, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, orderNo=0, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1278417561654727619, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, authorId=1278417561579230145, language=EN, stringName=Kexin Guo, firstName=Kexin, middleName=null, lastName=Guo, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=Shaanxi Hengtai Electronic Technology Co., Ltd., Xi’an, Shaanxi, 710021, China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1278417561713447876, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, authorId=1278417561579230145, language=CN, stringName=郭可欣, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=陕西恒太电子科技有限公司, 中国·陕西 西安 710021, bio={"content":"郭可欣(1998—),女,中国陕西西安人,本科,助理工程师,从事电子元器件检测、可靠性试验、破坏性物理分析研究。
"}, bioImg=null, bioContent=郭可欣(1998—),女,中国陕西西安人,本科,助理工程师,从事电子元器件检测、可靠性试验、破坏性物理分析研究。
, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1278417561486955453, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, xref=null, ext=[AuthorCompanyExt(id=1278417561507926974, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, companyId=1278417561486955453, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=Shaanxi Hengtai Electronic Technology Co., Ltd., Xi’an, Shaanxi, 710021, China), AuthorCompanyExt(id=1278417561524704191, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, companyId=1278417561486955453, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=陕西恒太电子科技有限公司, 中国·陕西 西安 710021)])]), Author(id=1278417561767973830, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, orderNo=1, firstName=null, middleName=null, lastName=null, nameCn=null, orcid=null, stid=null, country=null, authorPic=null, dead=0, email=null, emailSecond=null, emailThird=null, correspondingAuthor=0, authorType=1, ext={EN=AuthorExt(id=1278417561843471304, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, authorId=1278417561767973830, language=EN, stringName=Xingru Li, firstName=Xingru, middleName=null, lastName=Li, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=Shaanxi Hengtai Electronic Technology Co., Ltd., Xi’an, Shaanxi, 710021, China, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null), CN=AuthorExt(id=1278417561902191561, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, authorId=1278417561767973830, language=CN, stringName=李星儒, firstName=null, middleName=null, lastName=null, prefix=null, suffix=null, authorComment=null, nameInitials=null, affiliation=null, department=null, xref=null, address=陕西恒太电子科技有限公司, 中国·陕西 西安 710021, bio=null, bioImg=null, bioContent=null, aboutCorrespAuthor=null)}, companyList=[AuthorCompany(id=1278417561486955453, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, xref=null, ext=[AuthorCompanyExt(id=1278417561507926974, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, companyId=1278417561486955453, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=Shaanxi Hengtai Electronic Technology Co., Ltd., Xi’an, Shaanxi, 710021, China), AuthorCompanyExt(id=1278417561524704191, tenantId=1045748351789510663, journalId=1253638481449877673, articleId=1278319868676776524, companyId=1278417561486955453, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=陕西恒太电子科技有限公司, 中国·陕西 西安 710021)])])]
郭可欣,李星儒.
面向工程应用的电子元器件检测流程优化研究[J].
现代工业与技术, 2025, 2(8): 7-9 DOI:10.12349/mit.v2i8.8897
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