The film-substrate system is widely used in various industrial applications, and a comprehensive understanding of its mechanical response under various loads is crucial for optimizing the design and application of flexible electronics and soft robotics. However, the buckling analysis of finite-size film-substrate systems under local indentation remains insufficiently explored, which significantly hinders the practical application and technological advancement of related devices. To address this gap, a combination of experimental testing, numerical simulations, and theoretical analyses was employed to systematically investigate the buckling mechanical behavior of finite-size film-substrate systems subjected to local indentation. The findings show that the instability behavior of these systems under local indentation differs markedly from that predicted by finite-size models. Specifically, when the indentation depth exceeds a critical threshold, the film-substrate system undergoes buckling. As the indentation depth increases further, the buckling patterns transition from an initial symmetric state to an asymmetric state. In addition, the buckling behavior can be effectively controlled by adjusting geometric parameters and material properties. The results provide essential theoretical insights and technical support for the structural design of flexible electronic devices and soft robotics, as well as for understanding the buckling behavior in natural film-substrate systems.
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