从微波光子到光电融合

From microwave photonics to optoelectronic fusion

摘要

微波电子学在处理高频宽带信号时，长期受限于电子器件的带宽、传输损耗与电磁干扰，而将信号调制到光载波上进行产生、传输与处理，可有效规避这些限制，这正是微波光子学的核心思路。近年来，随着集成度需求提升，这一“光电融合”的思路正从系统链路层向芯片器件与材料层延伸。该文以电子科技大学光电科学与工程学院相关团队的工作为例，围绕这一脉络梳理 3 个层面的关键技术：在系统层，介绍光电振荡器、光频梳与光子模数转换如何实现低相噪信号产生与宽带信号采样；在支撑层，讨论高速光电子芯片面临的测试难题，包括晶圆级非侵入探测与频响解耦，这是器件走向工程应用的前提；在材料层，介绍二维滑移铁电材料在存算一体器件中的应用，以及多维光场探测器对偏振等信息的获取。3 个层面共同反映出光电融合由链路走向器件、由分立走向集成的技术走向，也提示材料与器件层的本征融合将是后续突破的关键方向。

Abstract

In the processing of high-frequency broadband signals, microwave electronics has long been constrained by the bandwidth, transmission loss, and electromagnetic interference of electronic devices. Modulating signals onto optical carriers for generation, transmission, and processing can effectively circumvent these limitations, which constitutes the core paradigm of microwave photonics. In recent years, driven by the increasing demand for integration, this concept of “optoelectronic fusion” has been extending from the system-link level down to the chip, device, and material levels. Taking the research work of related teams from the School of Optoelectronic Science and Engineering at the University of Electronic Science and Technology of China (UESTC) as examples, this paper reviews the key technologies across three levels along this trajectory: At the system level, it introduces how optoelectronic oscillators (OEOs), optical frequency combs (OFCs), and photonic analog-to-digital converters (photonic ADCs) achieve low-phase-noise signal generation and broadband signal sampling. At the supporting level, it discusses the characterization and testing challenges faced by high-speed optoelectronic chips, including wafer-level non-invasive probing and frequency response decoupling, which are essential prerequisites for transitioning devices toward engineering applications. At the material level, it highlights the applications of two-dimensional (2D) sliding ferroelectric materials in in-memory computing devices, as well as multi-dimensional optical field photodetectors for capturing multi-parameter information such as polarization. Collectively, these three levels reflect the technological evolution of optoelectronic fusion from links to devices and from discrete components to integrated systems, while indicating that intrinsic fusion at the material and device levels will be a critical direction for future breakthroughs.

关键词

微波光子学 / 光电融合 / 滑移铁电 / 多维光场

Key words

microwave photonics / optoelectronic fusion / sliding ferroelectricity / multi-dimensional optical field

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基金资助

国家自然科学基金(61927821, 62375042)

四川省科技计划(2025ZYD0182)